Under the terms of the agreements, interpack and Ipack-Ima will reciprocally support their packaging trade fairs held in Düsseldorf and Milan whilst UCIMA will provide support to the international events...
At SWOP 2017, Nov. 7-10 at the Shanghai New International Expo Centre (SNIEC), a large number of internationally advanced and innovative processing and packaging products for the confectionery and bakery...
Revolutionary Films and Foils Embossing and 3D Printing on the Show: At the K` 2016 from 19 to 26 October 2016, SAUERESSIG will be presenting innovative embossing roller technologies with...
A Thermoformer Chooses Bandera for its First Extrusion Line: An important Spanish thermoformer has invested in its first extrusion line, choosing the PET/PP technology by Bandera. With this new line,...